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BSP300H6327

Model BSP300H6327  |  Category discrete
USD / unit (reference)

BSP300H6327 — Discrete Semiconductor Products > Transistors > FETs, MOSFETs > Single FETs, MOSFETs. Series: SIPMOS®; Packaging: Tape & Reel (TR) Cut Tape (CT) Digi-Reel®; Part Status: Obsolete; Mounting Type: Surface Mount

MfrInfineon Technologies
SeriesSIPMOS®
PackagingTape & Reel (TR) Cut Tape (CT) Digi-Reel®
Part StatusObsolete
FET TypeN-Channel
TechnologyMOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)800 V
Current – Continuous Drain (Id) @ 25°C190mA (Ta)
Drive Voltage (Max Rds On, Min Rds On)10V
Rds On (Max) @ Id, Vgs20Ohm @ 190mA, 10V
Vgs(th) (Max) @ Id4V @ 1mA
Vgs (Max)±20V
Input Capacitance (Ciss) (Max) @ Vds230 pF @ 25 V
FET Feature
Power Dissipation (Max)1.8W (Ta)
Operating Temperature-55°C ~ 150°C (TJ)
Mounting TypeSurface Mount
Supplier Device PackagePG-SOT223-4
Package / CaseTO-261-4, TO-261AA
StockIn Stock
Bulk pricing & lead time: +86 13246607911 · info@winchipgroup.com

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