PIC16(L)F15354/55 microcontrollers feature analog, Core Independent Peripherals and communication peripherals, combined with eXtreme Low-Power (XLP) technology for a wide range of general purpose and low-power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
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