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EX-Z12FA-P

Model EX-Z12FA-P  |  Category other
USD / unit (reference)

The world’s thinnest* sensor dimension of 3 mm 0.118 in has been achieved by utilizing new semiconductor packaging technology that does not use wire bonding. The small unit size allows installation of sensors in a narrow space where only a conventional fiber sensor head could be installed before. The built-in amplifier also saves on installation space. * Among photoelectric sensors with built-in amplifier, as of April 2017 in-company survey

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Bulk pricing & lead time: +86 13246607911 · info@winchipgroup.com

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