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X3C26P1-03S

Model X3C26P1-03S  |  Category other
USD / unit (reference)

The X3C26P1-03S is a low profile, high performance 3dB hybrid coupler in a new easy to use, manufacturing friendly surface mount package. It is designed for LTE, WIMAX applications. The X3C26P1- 03S is designed particularly for balanced power and low noise amplifiers, plus signal distribution and other applications where low insertion loss and tight amplitude and phase balance is required. It can be used in high power applications up to 100 watts. Parts have been subjected to rigorous qualification testing and the are manufactured using materials with coefficients of thermal expansion (CTE) compatible with common substrates such as FR4, G-10, RF-35, RO4003 and polyimide. Produced with 6 of 6 RoHS compliant tin immersion finish.

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Bulk pricing & lead time: +86 13246607911 · info@winchipgroup.com

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